Technology Kiosk Showcase

How to View 2026 Abstracts:

  1. To view all abstract titles, author and content click on the button below to be redirected to myAdvantest.
  2. Login with your myAdvantest credentials or sign up for an account clicking the “New User” tab on the myAdvantest portal.
  3. New accounts will be verified within 3-5 business days, at which time you will get full access to VOICE technology kiosk abstracts.

2026 Technology Kiosk Titles

M4171: Single-Site Pick-and-Place Handler

Yoshiki Baba and Yoshinori Ueno, Advantest

Velocity: Powering the AI-Era Design Flow

Bill Wymbs, Advantest

Easy Insights Using the SMU8 Process Monitoring System

Daniel Jang, Advantest

SLT/BI Test Solutions for High-Performance Compute Devices

John Langmack, Advantest

Accelerating Silicon Validation and Test Engineering with SiConic™

Pete Hodakievic, Advantest

V93000 AI-Driven Test Program Development: Flexible Integration of Cutting-Edge Generative AI Technologies

Mykola Zakharchuk, Brian Buras, Stefan Morgenweck, Advantest

Real-Time Large-Volume Data Transfer in T2000 Semiconductor Test Systems

Koji Miyauchi, Advantest

TDC AI Solution for T2000/T6391

Shintaro Yoshikawa, Advantest

ATE Interface and Interconnect Solutions

Steve Mirabelli, Advantest 

Wave Scale RF20ex: Advancing Next Generation RF ATE for Wi Fi 7, 6G, UWB

Oscar Solano, Kheng How Tan, Eng Keong Tan, Advantest

New V93000 Demodulation Features

Joe Kelly and Max Seminario, Advantest

Expanding HVM Testing into a New Domain: Silicon Photonics & Co-Packaged Optics

Dimitri Malsam and Aether Lee, Advantest 

Production-Ready ML Without the Pain: ModelOps for Test Engineers

ZhiJun Xue, Advantest 

ACS RTDI™ AI-Driven Data Insights: Where Engineering Meets Intelligence

Yue Chen and Ashwani Agarwal, Advantest 

Digital Multiplexing

Gyana Patra, Fabio Pizza and Daniel Madre, Advantest 

Enabling High-Volume Manufacturing Test of Co-Packaged Copper and Optical Devices Using a Modular Platform Approach

Preet Paul Singh, Ira Leventhal and James Hastings, Advantest

An End-to-End Dataflow for Tessent SSN

Helmut Schmid and Aditya Patnaik, Advantest, J-F Coté, Siemens

Single Insertion Diagnostic: Using the Universal Diagnostic Interface Board

Steffen Baier, Advantest 

Pin Scale Multilevel Serial: Specification Update of PAM4 Signal and New Features

Takatoshi Yoshino, Advantest 

Interleaved Testflow Execution for Parallel Test 

Michael Vogt, Advantest 

Advantest Talks Semi 

Don Ong and Hunter Landers, Advantest